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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6302 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 1/4 HMPSA06 NPN SILICON TRANSISTOR Description Amplifier transistor Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 625 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 80 V VCEO Collector to Emitter Voltage ...................................................................................... 80 V VEBO Emitter to Base Voltage .............................................................................................. 4 V IC Collector Current........................................................................................................ 500 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO ICEO *VCE(sat) *VBE(on) *hFE1 *hFE2 fT Min. 80 80 4 50 50 100 Typ. Max. 100 100 0.25 1.2 Unit V V V nA nA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=100uA, IC=0 VCB=80V, IE=0 VCE=60V, IB=0 IC=100mA, IB=10mA IC=100mA, VCE=1V IC=10mA, VCE=1V IC=100mA, VCE=1V IC=10mA, VCE=2V, f=100MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz HMPSA06 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 VCE(s at) @ IC=10IB Spec. No. : HE6302 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o 25 C o Saturation Voltage (mV) hFE 100 75 C o 100 o 75 C 25 C o o 125 C hFE @ VCE=1V 10 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 1000 o Cutoff Frequency & Ic 1000 25 C ON Voltage (mV) 125 C o Cutoff Frequency (MHz).. . VCE=2V 100 75 C o VBE(ON) @ VCE=1V 100 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10000 Safe Operating Area Collector Current-IC (mA) 1000 Capacitance (pF) PT=1ms 100 PT=100ms PT=1s 10 10 Cob 1 0.1 1 10 100 1000 1 1 10 100 1000 Reverse Biased Voltage (V) Forward Voltage-VCE (V) HMPSA06 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6302 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD (mW) 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta ( C) HMPSA06 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6302 Issued Date : 1992.09.09 Revised Date : 2002.02.21 Page No. : 4/4 2 Marking: H MP S A06 Control Code 3 C Style: Pin 1.Emitter 2.Base 3.Collector D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMPSA06 HSMC Product Specification |
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